Inquivix Technologies ozone water generators dissolve high-concentration ozone gas into ultrapure water to produce functional ozonated DI water for semiconductor wafer cleaning, photoresist stripping, organic contamination removal, and controlled surface oxidation. Each ozone water supply system includes a built-in ozone destruction unit with high-efficiency UV reflection technology for safe handling of residual ozone gas.
10–100 ppm
Ozone in DI Water
Configurable concentration
UV Reflection
Ozone Destruction
Built-in, fab-compliant
< 5 ppb TOC
UPW Compatibility
≥ 18.2 MΩ·cm resistivity
SECS/GEM
Fab Communication
MES integration ready
The Inquivix Technologies ozone water system generates high-concentration ozone gas and dissolves it into ultrapure water to produce functional ozonated DI water at the point of use. Configurable concentrations from 10 to 100 ppm let each system match the specific oxidation requirements of every semiconductor wet process.
Ozone water provides a chemical-free alternative to traditional wet cleaning chemistries, most notably sulfuric peroxide mixtures (SPM / piranha solution). By replacing SPM with ozonated ultrapure water in applicable cleaning steps, semiconductor fabs reduce hazardous chemical consumption, lower chemical waste disposal costs, eliminate the safety risks associated with hot sulfuric acid handling, and achieve more uniform oxidation across the wafer surface, without compromising process performance.
Replace SPM (piranha) in applicable cleaning steps with ozonated UPW, strong oxidation without hot sulfuric acid handling, hazardous waste, or chemical procurement burden.
Integrated UV reflection destruction unit neutralizes residual ozone before exhaust, meeting fab environmental and safety requirements.
Touch-panel monitoring of concentration, flow, and destruction status, paired with SEMI SECS/GEM for MES integration and recipe automation.
Detail
UV Reflection Ozone Destruction Unit
Spec sheet shown reflects standard output ranges across configurations. For utility inputs, system sizing, and detailed component-level documentation, request the full specification package.
Ozone water systems are available in multiple configurations to match specific semiconductor process requirements. Contact Inquivix Technologies for detailed specifications, system sizing, and utility requirements.
Five mechanical, control, and integration pillars define the Inquivix Technologies ozone water platform, from gas-liquid dissolution to fab-level automation.
Advanced gas-liquid dissolution process achieves consistent and uniform ozone concentration in the output DI water stream. The dissolution architecture is engineered for stable ozone delivery across varying process demand, ensuring repeatable concentration performance throughout production runs.
Integrated ozone destruction unit uses high-efficiency UV reflection technology to decompose residual ozone gas before it reaches the facility exhaust system. The destruction system achieves thorough ozone neutralization for fab environmental and safety compliance.
Ozonated ultrapure water provides strong oxidation capability without the chemical hazards, disposal costs, or environmental burden of traditional SPM cleaning chemistry. Ozone decomposes to oxygen and water, leaving no chemical residue on the wafer surface and no hazardous waste stream to manage.
Integrated touch panel interface provides real-time monitoring and control of ozone concentration, DI water flow rate, ozone destruction system status, system alarms, and equipment health from a single centralized display.
Every Inquivix Technologies ozone water system supports SEMI SECS/GEM protocols for automated process control, real-time equipment status monitoring, alarm management, and process data collection through your fab's MES infrastructure.
Four high-value process steps where ozonated DI water replaces or augments traditional chemical cleaning, backed by Inquivix Technologies process integration support.
High-concentration ozone water provides a chemical-free alternative to sulfuric peroxide mixtures (SPM) for photoresist stripping in applicable semiconductor wet bench processes. Delivers consistent oxidation power without the safety risks of hot sulfuric acid, the chemical procurement costs, or the hazardous waste burden of SPM chemistry.
Highly effective removal of organic contaminants from wafer surfaces during pre-diffusion cleaning, post-etch residue removal, and inter-step cleaning sequences. The strong oxidation capability of dissolved ozone breaks down organic molecules on contact, preparing the surface for thermal or deposition processing.
Controlled ozone water treatment produces a thin, uniform chemical oxide layer on silicon wafer surfaces. The oxide serves as a passivation layer that protects the surface during queue time between process steps and provides a consistent starting surface for subsequent gate oxide growth or thermal oxidation.
Ozone water systems serve flat-panel display glass cleaning, thin-film transistor (TFT) processing, and solar cell wafer preparation. The chemical-free oxidation process reduces environmental impact, lowers chemical handling costs, and simplifies waste stream management in high-volume display and photovoltaic manufacturing lines.
Inquivix Technologies provides complete process integration engineering for every ozone water system deployment, from ozone delivery system design and concentration matching, to ozone destruction and exhaust coordination, safety interlock integration, and SECS/GEM communication configuration for connection to your fab's MES infrastructure.
Whether you are replacing SPM chemistry in existing wet bench operations, specifying ozone water capability for a new fab build, or evaluating ozone water generators for integration into your wet process equipment platform, the Inquivix Technologies engineering team will assess your requirements and configure the right system.