Our hydrogen water generators dissolve ultra-pure hydrogen into deionized water through PEM electrolysis and hollow fiber membrane injection, producing stable dissolved hydrogen concentrations for semiconductor wafer cleaning applications. Designed for integration with existing ultrapure water (UPW) delivery lines, these systems eliminate the need for bulk hydrogen gas cylinder supply while providing real-time concentration monitoring and closed-loop process control through an integrated HMI touch panel.

Semiconductor fabs use dissolved hydrogen water to reduce metallic contamination on wafer surfaces, passivate active layers during wet cleaning sequences, and improve particle removal efficiency compared to conventional DI water rinse alone. The dissolved hydrogen water system operates across a configurable UPW flow range, making it suitable for both single-tool and batch processing environments.

Our hydrogen gas generators produce semiconductor-grade hydrogen at 99.999% purity (5N) using solid polymer electrolyte (PEM) cell technology. These on-site hydrogen gas generation systems replace traditional compressed hydrogen cylinder supply with a safer, more consistent, and cost-effective source of high-purity H₂ gas for semiconductor manufacturing processes.

Each hydrogen gas generator includes internal leak testing, automatic shutdown safety interlocks, and supports SECS/GEM communication standards for seamless fab integration. Applications include reducing atmospheres for annealing processes, ammonia-diluted hydrogen environments, and carrier gas supply for thin film deposition, chemical vapor deposition (CVD), and physical vapor deposition (PVD) chambers in semiconductor and advanced packaging facilities.

Our ozone water systems dissolve high-concentration ozone gas into ultrapure water to produce functional ozonated water for semiconductor wafer cleaning and surface treatment. These ozone water generators replace traditional chemical cleaning agents such as sulfuric peroxide mixtures (SPM) with a chemical-free alternative that reduces hazardous waste, lowers operating costs, and delivers superior oxidation uniformity across wafer surfaces.

Built-in ozone destruction units with 400% UV reflection technology ensure safe handling of residual ozone, and the integrated HMI touch panel provides centralized monitoring of concentration, flow rate, and system health. Ozone water is widely adopted across semiconductor, photovoltaic, and flat panel display manufacturing for photoresist stripping, organic contamination removal, and thin chemical oxide growth on silicon wafer surfaces.

Our ozone gas generators deliver high-concentration ozone at up to 300 g O₃/Nm³ in the gas phase, with adjustable O₂ flow rates from 5 to 40 slm for precise process control. Engineered with a patented internal cell design that maximizes ozone output while minimizing oxygen consumption, these ozone gas generators are deployed across semiconductor oxidation processes, lithography support, dry cleaning operations, and medical sterilization applications.

The compact footprint enables integration into space-constrained semiconductor fab environments without compromising ozone output capacity. All ozone gas generator systems carry CE and UL certifications and support SECS/GEM communication protocols for automated process control in semiconductor manufacturing execution systems.